NXP Semiconductors Breaks Ground on Assembly and Test Site Expansion in Malaysia
NXP has broken ground on a 500,000 square foot assembly and test expansion in Petaling Jaya, Malaysia, taking the site to around 900,000 square feet and more than doubling its…
Impinj Move manufacturing of R700 from United States to Malaysia
Impinj has announced a significant change to the production of its flagship R700 Antenna Hub, transitioning assembly operations from the United States to Malaysia. Starting in July 2026, the RAIN…
Touch ’n Go Unveils Next-Gen Open Payment Mobility Ecosystem at MyARTTE 2025
Malaysia’s Touch ’n Go has taken a bold stride into the future of mobility by revealing its latest open-payment and mobility ecosystem during the My-ASEAN Roads & Traffic Tech Expo…
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