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NXP

NXP Semiconductors Breaks Ground on Assembly and Test Site Expansion in Malaysia

NXP Semiconductors Breaks Ground on Assembly and Test Site Expansion in Malaysia

NXP has broken ground on a 500,000 square foot assembly and test expansion in Petaling Jaya, Malaysia, taking the site to around 900,000 square feet and more than doubling its…

Avery Dennison ships the first UCODE X inlays – eight months from chip launch to a globally tuned inlay

Avery Dennison ships the first UCODE X inlays – eight months from chip launch to a globally tuned inlay

Eight months after NXP launched UCODE X, Avery Dennison has shipped ARC certified inlays built on it. The AD Miniweb Global UCODE X packs a 42 by 16 mm antenna…

NXP Trimension UWB powers BMW Group Digital Key Plus

NXP Trimension UWB powers BMW Group Digital Key Plus

NXP Semiconductors has confirmed that its Trimension NCJ29D6 ultra-wideband family will be deployed across the BMW Group fleet, starting with selected 2026 vehicle programmes. The same UWB silicon handles two…

NXP Semiconductors Q2 2026 with $3.5B Revenue, CommInfra +41% YoY

NXP Semiconductors Q2 2026 with $3.5B Revenue, CommInfra +41% YoY

NXP Semiconductors has posted strong second-quarter 2026 results, reporting total revenue of $3.5 billion. The figure represents a 19% increase year-on-year and 10% growth quarter-on-quarter, with every business segment and…

NXP Semiconductors Q1 2026 Results – UCODE RFID Product Ramp Cited as Key Growth Driver

NXP Semiconductors Q1 2026 Results – UCODE RFID Product Ramp Cited as Key Growth Driver

NXP Semiconductors has posted strong first-quarter 2026 results, with revenue hitting $3.18 billion and year-over-year growth of 12%. While the Dutch chipmaker’s automotive and edge AI divisions grabbed headlines, it…

Schreiner ProTech Presents Expanded NXP UCODE 9 RFID Labelling Portfolio at LogiMAT 2026

Schreiner ProTech Presents Expanded NXP UCODE 9 RFID Labelling Portfolio at LogiMAT 2026

Schreiner ProTech showcased its expanded portfolio of RFID labelling solutions built around the next-generation NXP UCODE 9 chip family at LogiMAT 2026, held March 24 to 26 in Stuttgart, Germany.…

NXP Simplifies NFC EV charging authentication with New MIFARE DUOX

NXP Simplifies NFC EV charging authentication with New MIFARE DUOX

NXP Semiconductors has launched MIFARE DUOX, a new NFC contactless IC that brings together asymmetric and symmetric cryptography on a single chip for the first time. The product is aimed…

NXP Advances Real-Time Industrial Positioning with New Omlox Starter Kit

NXP Advances Real-Time Industrial Positioning with New Omlox Starter Kit

NXP Semiconductors has unveiled its omlox Starter Kit, a turnkey development platform designed to simplify the deployment of ultra-wideband (UWB) real-time location systems (RTLS) in industrial environments. The kit brings…

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